{"id":7477,"date":"2019-11-21T09:07:47","date_gmt":"2019-11-21T09:07:47","guid":{"rendered":"https:\/\/www.langir.com\/?page_id=7477"},"modified":"2026-07-10T05:57:59","modified_gmt":"2026-07-10T05:57:59","slug":"soldering-profiles","status":"publish","type":"page","link":"https:\/\/www.langir.com\/tr\/soldering-profiles\/","title":{"rendered":"Lehimleme Profilleri"},"content":{"rendered":"
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\u00d6NER\u0130LEN LEH\u0130MLEme PROF\u0130LLER\u0130<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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Lehimleme ko\u015fullar\u0131, montaj ve PCB parametrelerinden etkilenir. Bu lehim profillerini kullan\u0131rken l\u00fctfen bu fakt\u00f6rleri g\u00f6z \u00f6n\u00fcnde bulundurun. Bunlar yaln\u0131zca \u00f6neri niteli\u011findedir ve herhangi bir garanti te\u015fkil etmez.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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MLCC\u2019LER \u0130\u00c7\u0130N REFLOW\/YEN\u0130DEN \u0130\u015eLEM SONRASI B\u0130LE\u015eEN TEST\u0130:<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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Reflow\/yeniden i\u015fleme i\u015flemlerinden sonra t\u00fcm bile\u015fen testleri, kapasitans de\u011ferlerinin do\u011fru bir \u015fekilde \u00f6l\u00e7\u00fclmesini sa\u011flamak i\u00e7in en az 24 saat sonra ger\u00e7ekle\u015ftirilmelidir. Seramik malzemenin s\u0131f\u0131rlanabilmesi (ya\u015flanabilmesi) i\u00e7in kondansat\u00f6rler en az 24 saat boyunca oda s\u0131cakl\u0131\u011f\u0131nda so\u011futulmal\u0131d\u0131r.<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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MSL SEV\u0130YES\u0130<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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MSL (Nem Hassasiyet Seviyesi) 1'dir<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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\u00d6NER\u0130LEN LEH\u0130M PROF\u0130LLER\u0130 (REFERANS)<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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Genellikle kullan\u0131c\u0131, tip, lehimleme testi konusunda \u00fcreticinin \u00f6nerileri ve PCB \u00fczerindeki bile\u015fenlerin birbirine yak\u0131nl\u0131\u011f\u0131, ekipman vb. gibi fakt\u00f6rleri g\u00f6z \u00f6n\u00fcnde bulundurarak, kendi uygulamas\u0131na en uygun y\u00f6ntemi ve s\u00fcreci se\u00e7er.<\/p>

Ayn\u0131 kriterler kur\u015funsuz (Pb) terminaller i\u00e7in de ge\u00e7erlidir. A\u00e7\u0131k\u00e7as\u0131, standartlar kur\u015funsuz (Pb) montaj macunlar\u0131na uygun olmal\u0131d\u0131r.<\/p>

Kaplama ala\u015f\u0131m\u0131n\u0131n \u00f6tektik s\u0131cakl\u0131\u011f\u0131, lehimleme i\u015flemi s\u0131cakl\u0131\u011f\u0131n\u0131n alt s\u0131n\u0131rlar\u0131n\u0131 belirler.<\/p>

Asgari lehimleme s\u0131cakl\u0131k aral\u0131\u011f\u0131, kaplama ala\u015f\u0131m\u0131n\u0131n \u00f6tektik s\u0131cakl\u0131\u011f\u0131ndan (teknik literat\u00fcre g\u00f6re) en az 5 \u00b0C ila 10 \u00b0C daha y\u00fcksek olmal\u0131d\u0131r.<\/p>

Cihazlar, lehim ba\u011flant\u0131lar\u0131n\u0131n d\u00fczg\u00fcn bir \u015fekilde \u0131slanmas\u0131n\u0131 sa\u011flamak i\u00e7in en y\u00fcksek lehimleme s\u0131cakl\u0131\u011f\u0131nda yeterince uzun s\u00fcre tutulmal\u0131d\u0131r. Bununla birlikte, cihazlar\u0131n zarar g\u00f6rme olas\u0131l\u0131\u011f\u0131n\u0131 \u00f6nlemek amac\u0131yla en y\u00fcksek lehimleme s\u00fcresinin m\u00fcmk\u00fcn oldu\u011funca k\u0131sa tutulmas\u0131 tavsiye edilir (teknik literat\u00fcre g\u00f6re).<\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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Yeniden Ak\u0131\u015f Profillerinin S\u0131n\u0131fland\u0131r\u0131lmas\u0131<\/strong><\/td><\/tr>
Profil \u00d6zelli\u011fi<\/strong><\/td>Sn \u2013 Pb \u00d6tektik Bile\u015fimi<\/strong><\/td>Kur\u015funsuz (Pb) Montaj<\/strong> (\u00f6rn. SnAgCu)<\/td><\/tr>
Ortalama art\u0131\u015f h\u0131z\u0131 (T(Maks.)<\/sub> T\u2019yeP<\/sub>)<\/td>Maksimum 3 \u00b0C\/s<\/td><\/td><\/tr>
\u00d6n \u0131s\u0131tma<\/strong>
  • En d\u00fc\u015f\u00fck s\u0131cakl\u0131k (TS (min.)<\/sub>)<\/li>
  • En y\u00fcksek s\u0131cakl\u0131k (TS(maks.)<\/sub>)<\/li>
  • Zaman (TS (min.)<\/sub> T\u2019yeS(maks.)<\/sub>) (tS<\/sub>)<\/li><\/ul><\/td>
100 \u00b0C
150 \u00b0C
60 saniye ile 120 saniye aras\u0131<\/td>		150 \u00b0C
200 \u00b0C
60 saniye ile 180 saniye aras\u0131<\/td><\/tr>
Zaman\u0131n bu seviyenin \u00fczerinde kalmas\u0131<\/strong>
  • En d\u00fc\u015f\u00fck s\u0131cakl\u0131k (TL (en az)<\/sub>)<\/li>
  • Zaman (TL<\/sub>)<\/li><\/ul><\/td>
183 \u00b0C
60 saniye ile 150 saniye aras\u0131<\/td>		217 \u00b0C
60 saniye ile 150 saniye aras\u0131<\/td><\/tr>
En d\u00fc\u015f\u00fck tepe s\u0131cakl\u0131\u011f\u0131 (TP (min.)<\/sub>)<\/td>215 \u00b0C<\/td>235 \u00b0C<\/td><\/tr>
\u00d6nerilen en y\u00fcksek s\u0131cakl\u0131k (TP<\/sub>)<\/td>235 \u00b0C<\/td>250 \u00b0C<\/td><\/tr>
Maksimum tepe s\u0131cakl\u0131k (TP(maks.)<\/sub>)<\/td>260 \u00b0C<\/td>260 \u00b0C<\/td><\/tr>
Ger\u00e7ek tepe s\u0131cakl\u0131\u011f\u0131n\u0131n \u00b15 \u00b0C aral\u0131\u011f\u0131ndaki s\u00fcre (tP<\/sub>)<\/td>10 saniye ile 40 saniye aras\u0131<\/td>20 saniye ile 40 saniye aras\u0131<\/td><\/tr>
Azaltma h\u0131z\u0131<\/td>En fazla 6 \u00baC\/s<\/td>En fazla 6 \u00baC\/s<\/td><\/tr>
25 \u00b0C\u2019den en y\u00fcksek s\u0131cakl\u0131\u011fa ula\u015fma s\u00fcresi<\/td>En fazla 6 dakika<\/td>En fazla 8 dakika<\/td><\/tr><\/tbody><\/table>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t
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Elle Lehimleme ve S\u0131cakl\u0131klar<\/strong><\/p>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t

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Notlar<\/strong><\/p>

  • Bu belge yaln\u0131zca \u00f6neri niteli\u011finde olmal\u0131d\u0131r. Lehimleme i\u015flemini etkileyebilecek ba\u015fka parametreler de olabilece\u011finden, bu profiller mutlak ba\u015far\u0131y\u0131 garanti etmez.<\/li>
  • Lehim profili, bu belgedeki \u00f6nerilerle \u00e7eli\u015fmemesi kayd\u0131yla, lehim macunu \u00fcreticisi taraf\u0131ndan belirlenmelidir.<\/li><\/ul>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t
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    Lehim Havyas\u0131 i\u00e7in \u00d6nerilen Teknik \u00d6zellikler<\/strong><\/td><\/tr>
    Lehimleme S\u0131cakl\u0131\u011f\u0131 (\u00b0C)<\/strong><\/td>\u00d6n Is\u0131tma S\u0131cakl\u0131\u011f\u0131 (\u00b0C) (bile\u015fen veya kart)<\/strong><\/td>\u00d6n Is\u0131tma S\u00fcresi (sn)<\/strong><\/td>Maks. S\u0131cakl\u0131k De\u011fi\u015fimi (\u00b0C)<\/strong><\/td>Maks. Lehimleme S\u00fcresi (sn)<\/strong><\/td>G\u00fc\u00e7 (Watt)<\/strong><\/td>U\u00e7 \u00c7ap\u0131<\/strong><\/td>Lehimleme S\u00fcresi<\/strong><\/td><\/tr>
    280~300<\/td>\u2265150 \u00b0C<\/td>\u226560 saniye<\/td>\u25b3T\u2264130<\/td>\u22645 saniye<\/td>Maks. 30 W.<\/td>Maks. 3 mm.<\/td>En fazla 2~3 saniye.<\/td><\/tr><\/tbody><\/table>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t
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    \n\t\t\t\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t<\/section>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

    RECOMMENDED SOLDERING PROFILES Soldering conditions are affected by mounting and PCB parameters. Please take these factors into account when using these solder profiles. These are recommendations only and no guarantees are implied by them. COMPONENT TESTING AFTER REFLOW\/REWORK FOR MLCC’S: All component testing after reflow\/rework should be performed after \u2265 24hrs to ensure accurate capacitance […]<\/p>\n","protected":false},"author":1,"featured_media":7426,"parent":0,"menu_order":21,"comment_status":"closed","ping_status":"closed","template":"page-soldering-profiles","meta":{"_angie_page":false,"_metasync_otto_title":"","_metasync_otto_description":"","_metasync_otto_keywords":"","_metasync_otto_og_title":"","_metasync_otto_og_description":"","_metasync_otto_twitter_title":"","_metasync_otto_twitter_description":"","rank_math_title":"","rank_math_description":"Soldering conditions are affected by mounting and PCB parameters. Please take these factors into account when using these soldering profiles. ","_yoast_wpseo_title":"","_yoast_wpseo_metadesc":"","_aioseo_title":"","_aioseo_description":"","_metasync_seo_title":"","_metasync_seo_desc":"","_metasync_breadcrumb_title":"","_metasync_primary_category":0,"_metasync_primary_product_cat":0,"_metasync_otto_disabled":"","_metasync_hreflang":"","_metasync_plugin_sync_ts":"","_metasync_robots_advanced":"","footnotes":""},"class_list":["post-7477","page","type-page","status-publish","has-post-thumbnail","hentry"],"_links":{"self":[{"href":"https:\/\/www.langir.com\/tr\/wp-json\/wp\/v2\/pages\/7477","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.langir.com\/tr\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.langir.com\/tr\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.langir.com\/tr\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.langir.com\/tr\/wp-json\/wp\/v2\/comments?post=7477"}],"version-history":[{"count":0,"href":"https:\/\/www.langir.com\/tr\/wp-json\/wp\/v2\/pages\/7477\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.langir.com\/tr\/wp-json\/wp\/v2\/media\/7426"}],"wp:attachment":[{"href":"https:\/\/www.langir.com\/tr\/wp-json\/wp\/v2\/media?parent=7477"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}