Soldering Profiles

RECOMMENDED SOLDERING PROFILES

Soldering conditions are affected by mounting and PCB parameters. Please take these factors into account when using these solder profiles. These are recommendations only and no guarantees are implied by them.

COMPONENT TESTING AFTER REFLOW/REWORK FOR MLCC’S:

All component testing after reflow/rework should be performed after ≥ 24hrs to ensure accurate capacitance value measurements. Capacitors should be cooled at room temperature for a minimum of 24 hours to allow the ceramic material to reset (age).

MSL LEVEL

MSL (Moisture Sensitivity Level) is 1

RECOMMENDED SOLDERING PROFILES (REFERENCE)

Normally, the user adopts the method and the process best suited for their own application, taking into account such factors as type, the manufacturer’s recommendation on soldering test and proximity of components on the PCB, equipment, etc.

The same criteria are applicable for lead (Pb)-free terminals. Obviously, the standards should be pertinent to lead (Pb)-free mounting pastes.

The eutectic temperature of the plating alloy determines the minimum limits of the soldering process temperature.

The minimum soldering temperature range should be at least 5 °C to 10 °C higher than the eutectic temperature of the plating alloy (per technical literature).

The devices must be held at the peak soldering temperature long enough to ensure the proper wetting of the solder connections. However, keeping the peak soldering time to a minimum to avoid the possibility of damage to the devices is recommended (per technical literature).

Hand Soldering and Temperatures

Notes

• This document should serve as recommendation only. Other parameters may also affect soldering, so these profiles do not guarantee absolute success.
• Soldering profile should be determined by the manufacturer of the solder paste, providing there is no contradiction with the recommendations in this document.